ROHM Semiconductor

Ref. [hkinrohmsemiconductor20220620][hkinbrandcloudAMpd]

ROHM was established in Kyoto in 1958 as initially a manufacturer of small electronic components. In 1967 production was expanded to include transistors and diodes, and in 1969 ICs and other semiconductor products were added to the lineup. Two years later (in 1971), going against conventional Japanese business culture, the company entered the US market by establishing a sales office and IC design center in Silicon Valley. Through the hard work and passionate dedication of its young work force, business flourished, causing the industry to take notice. ROHM's expansion overseas soon became a template for other companies and eventually was accepted as common business practice.

Rated (4/5) based on 10 customer reviews
Part Number BU8871F-E2
Main Category Integrated Circuits (ICs)
Sub Category Interface - Telecom
Brand ROHM Semiconductor
Description IC DTMF RECEIVER SOP18 TR
Series -
Packaging Tape & Reel (TR)
Function Receiver, DTMF
Interface -
Number of Circuits 1
Voltage - Supply 4.75 V ~ 5.25 V
Current - Supply 2.2mA
Power (Watts) 550mW
Operating Temperature -10°C ~ 70°C
Mounting Type Surface Mount
Package / Case 18-SOIC (0.213", 5.40mm Width)
Supplier Device Package 18-SOP
Image Integrated Circuits (ICs)
Lowest Price: $0.12   Highest Price: $3.81
1 - 5 of 5 Record(s)
Part Number
Brand
D/C
Qty
Price (USD)
Company
Part Number:

BU8871F-E2

Brand:

ROHMSemiconductor

D/C:
Qty:

3322

Price (USD):

0.12

Company:

HK HEQING ELECTRONICS LIMITED

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Part Number:

BU8871F-E2

Brand:

ROHM

D/C:
21+
Qty:

1138

Price (USD):

1.0425

Company:

ONSTAR ELECTRONICS CO., LIMITED

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Part Number:

BU8871F-E2

Brand:

Rohm Semiconductor

D/C:
20+
Qty:

8862

Price (USD):

1.965

Company:

Fairstock HK Limited

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Part Number:

BU8871F-E2

Brand:

ROHM/

D/C:
21+
Qty:

3833

Price (USD):

2.8875

Company:

HITO TECHNOLOGY LIMITED

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Part Number:

BU8871F-E2

Brand:

ROHM?[Rohm]

D/C:
21+
Qty:

8425

Price (USD):

3.81

Company:

HongKong JDG Electronic Co., Limited

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BU8871FE2 Ref.

[hkinrohmsemiconductor20220620][hkinbrandcloudAMpd]
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